Effect of Interface Curvature on Local Growth Behavior and Stress of Thermal Barrier Coatings

It is well known that coating spalling often occurs between the top ceramic coating (TC) and the metal bonding coating (BC) during the working process where the thermal mismatch stress between the layers plays a key role. Dynamic changes in the thermally grown oxide (TGO) between the facing and bonding layers during thermal cycling increase the thermal mismatch at the interface. The effect of oxide thickening on localized mismatch stresses under thermal cycling with different interfacial curvatures is quantitatively investigated using numerical methods in this paper. A dynamic growth model of the oxide was developed based on the consideration of the composition and morphology of the thermally grown oxide. The results show that TGO growth behavior, local stress evolution, crack initiation location, and crack propagation length are influenced by the interface curvature at the same aspect ratio. The interface between the oxide layer and the bonding layer gradually developed significant tensile to dangerous stresses during thermal cycling. These tensile stresses are predominantly distributed at the crest during the early stages of thermal exposure and gradually transferred to the near-peak (the region near the peak) and ramp regions (the region in between the peak and the valley) as the oxidation process progressed. The crack initiation and propagation phenomenon can be observed at various regions during thermal exposure. Increasing interface curvature leads to an earlier dangerous stress moment in the ramp area due to higher maximum tensile stress. Therefore, the small changes in the interface curvature severely affected the location and time of crack initiation and the crack length.