journal article·2022-10-15Open access

Finite Element Analysis of Nanoindentation Responses in Bi2Se3 Thin Films

Shu-Wei Cheng, Bo-Syun Chen, Sheng-Rui Jian, Yu-Min Hu, Phuoc Huu Le, Le Thi Cam Tuyen, Jyh-Wei Lee, Jenh-Yih Juang

Coatings· Volume 12· Issue 10

Abstract

In this study, the nanoindentation responses of Bi2Se3 thin film were quantitatively analyzed and simulated by using the finite element method (FEM). The hardness and Young’s modulus of Bi2Se3 thin films were experimentally determined using the continuous contact stiffness measurements option built into a Berkovich nanoindenter. Concurrently, FEM was conducted to establish a model describing the contact mechanics at the film/substrate interface, which was then used to reproduce the nanoindentation load-depth and hardness-depth curves. As such, the appropriate material parameters were obtained by correlating the FEM results with the corresponding experimental load-displacement curves. Moreover, the detailed nanoindentation-induced stress distribution in the vicinity around the interface of Bi2Se3 thin film and c-plane sapphires was mapped by FEM simulation for three different indenters, namely, the Berkovich, spherical and flat punch indenters. The results indicated that the nanoindentation-induced stress distribution at the film/substrate interface is indeed strongly dependent on the indenter’s geometric shape.
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Research context

OpenAlex topics: Metal and Thin Film Mechanics · Topological Materials and Phenomena · Force Microscopy Techniques and Applications

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Materials Science and Engineering, I-Shou University, Kaohsiung 84001, Taiwan

Department of Mechanical and Electro-Mechanical Engineering, National Sun Yat-sen University, Kaohsiung 80424, Taiwan

Department of Applied Physics, National University of Kaohsiung, Kaohsiung 81148, Taiwan

Department of Fragrance and Cosmetic Science, College of Pharmacy, Kaohsiung Medical University, Kaohsiung 80708, Taiwan

Department of Physics and Biophysics, Faculty of Basic Sciences, Can Tho University of Medicine and Pharmacy, Can Tho City 94000, Vietnam

Department of Chemical Engineering, College of Engineering Technology, Can Tho University, Can Tho City 900000, Vietnam

Department of Materials Engineering, Ming Chi University of Technology, New Taipei City 24301, Taiwan

Department of Electrophysics, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan

Funding

Ministry of Science and Technology, Taiwan

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