Show source-provided references
1. Stuttle, C.J. (2014). The electrodeposition of tin coatings from deep eutectic solvents and their subsequent whiskergrowth. [Ph.D. Thesis, Loughborough University].
3. The influence of potential-current conditions on the electrodeposition of Ni-Sn alloys from acidic chloride-sulphate solution
10.2478/amm-2014-0031 ↗6. Jellesen, M.S., and Moller, P. (2005). The electrochemical deposition of tin-nickel alloys and the corrosion properties of the coating. Plating Surf. Finish., 36–41.
7. Nobel, F., Ostrow, B.D., and Learonal Inc. (1991). Limiting tin sludge formation in tin or tin/lead electroplating solutions. (5066367 Appl. 07/585768), US Patent.
9. Deep eutectic solvents formed between choline chloride and carboxylic acids: Versatile alternatives to ionic liquids
10.1021/ja048266j ↗10. Abbott, A., Capper, G., Davies, D., Rasheed, R., and Tambyrajah, V. (2002). Novel solvent properties of choline chloride/urea mixtures. Chem. Commun., 70–71.
10.1039/b210714g ↗11. O-acetylation of cellulose and monosaccharides using a zinc based ionic liquid
10.1039/b511691k ↗12. Solubility of metal oxides in deep eutectic solvents based on choline chloride
10.1021/je060038c ↗15. Zinc electrodeposition from a deep eutectic system containing choline chloride and ethylene glycol
10.1149/1.3364930 ↗17. Abbott, A., Endres, F., and MacFarlane, D. (2017). Electrodeposition from Ionic Liquids, Wiley-VCH. [2nd ed.].
10.1002/9783527682706 ↗19. The effect of complex agents on the electrodeposition of tin from deep eutectic solvents
10.1149/2.003202eel ↗21. Studies of cathodic processes during NiSn alloy deposition using choline chloride based ionic liquids
23. Pulse plating as an alternative approach to improve Ni-Co alloys properties coated from a bath with a low nickel content
30. An improved technique for determining hardness and elastic-modulus using load and displacement sensing indentation experiments
10.1557/JMR.1992.1564 ↗34. A study of the current efficiency decrease accompanying short pulse time for pulse plating
10.1149/1.2096298 ↗38. Pulse plating of chromium-molybdenum coatings
39. Zinc Deposition by pulse plating
41. Romankiw, L.T. (2000). Micro-fabrication technologies on recent packaging. Electrochemical Technology Applications in Electronics, Electrochemical Society Proc.