Study on the Performances of Toughening UV-LED-Cured Epoxy Electronic Encapsulants
Source abstract
Abstract
This study aims to investigate the effects of three toughening agents—core–shell rubber particles (CSR), nano-silica particles (NSPs), and epoxidized polybutadiene (EPB)—on the performance of UV-LED-cured epoxy electronic encapsulants. By systematically comparing the curing behavior, thermomechanical properties, and impact resistance of different toughening agents in alicyclic epoxy resins, their potential applications in more environmentally friendly UV-cured electronic encapsulation are evaluated. The results show that NSP and CSR toughened samples have fast cured speed under 365 nm UV-LED light, but it affects the depth of curing under low energy conditions. They maintain high Tg, high modulus, and low thermal expansion coefficient (CTE), especially in the NSP-toughened sample. The EPB-toughened sample has good transparency for LED, but it has negative effects on Tg and CTE. This research provides essential theoretical and experimental data to support the development of high-performance UV-LED-cured epoxy encapsulation materials.
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Research context
OpenAlex topics: Silicone and Siloxane Chemistry · Railway Systems and Materials Science · Epoxy Resin Curing Processes
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Innovation Center of Functional Adhesion and Coating Technology, Department of Polymeric Materials, Key Laboratory of Advanced Civil Engineering Materials (Ministry of Education), School of Materials Science and Engineering, Tongji University, Shanghai 201804, China
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