Mechanism of Free Silver Formation While Preparing Silver-Coated Copper Powder by Chemical Plating and Its Control
Source abstract
Abstract
When silver-coated copper powder is produced through chemical plating, free silver is often formed, which not only lowers coating quality but also increases the consumption of silver salt. Therefore, understanding the mechanism of free silver formation during the chemical plating process is essential for improving this process and enhancing the quality of silver-coated copper powder. This paper investigates the contents of free silver as well as the morphology and properties of the powder under different conditions by varying reaction parameters during the preparation of silver-coated copper powder. The morphology, phase, and properties of the powder samples are characterized using scanning electron microscopy (SEM), X-ray diffraction (XRD), and a resistance tester. In addition, the cathodic polarization behavior of the plating solution is analyzed using an electrochemical workstation. The results show that the complexing agent, reaction temperature, main salt drop acceleration rate, and dispersant concentration all affect the generation of free silver, and the complexing agent has the greatest impact.
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Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Nanomaterials and Printing Technologies · Nanoporous metals and alloys
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650031, China
Yunnan Spring New Material Co., Ltd., Kunming 650212, China
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