journal article·2022-12-22Open access

Influence of Fin Thickness on the Thermal Performance and Selection of Coating Method for a Bus Duct Conductor

Mark Selvan, Mohd Sharizal Abdul Aziz, Mohd Arif Anuar Mohd Salleh, Nurulakmal Mohd Sharif, Chu Yee Khor, Heng Pin Ong, Mohd Remy Rozaini Mohd Arif Zainol, Petrica Vizureanu, Diana-Petronela Burduhos-Nergis, Andrei Victor Sandu

Coatings· Volume 13· Issue 1

Abstract

This paper studies the fin thickness variation effect on a bus duct conductor’s thermal performance and the nanocomposite coating method selection for the bus duct conductor’s heat sink. ANSYS FLUENT was used to create a numerical model resembling the experimental setup. The IEC 60439-1 and IEC 60439-2 standards were used to benchmark the experimental data. The results revealed that the “chimney effect” induces an increment of the hot air adjacent to the heat sink. A conspicuous increase in the total heat transfer rate and fin effectiveness was observed as the fin thickness was reduced. This study revealed that s1 = 1 mm was the best fin thickness with 1.254 fin effectiveness, 1.862 W of total heat transfer rate, and 17.5 Nusselt number. Additionally, various coating methods were examined experimentally to select the best nanocomposite coating for the bus duct conductor’s heat sink. The ultrasonic agitation was the best coating method, which resulted in the lowest average resistance (8.8 μΩ) and a better percentage of Ag (0.6%–2.5%) on the substrate surface. Thus, the current outcomes are expected to better comprehend the impact of fin thickness on thermal performance, as well as the selection of coating method for the bus duct conductor.
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Research context

OpenAlex topics: Thermal Analysis in Power Transmission · High voltage insulation and dielectric phenomena · Silicon Carbide Semiconductor Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Mechanical Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal 14300, Penang, Malaysia

Centre of Excellence Geopolymer and Green Technology, Universiti Malaysia Perlis (UniMAP), Kangar 01000, Perlis, Malaysia

School of Materials and Mineral Resources Engineering, Engineering Campus, Universiti Sains Malaysia, Nibong Tebal 14300, Penang, Malaysia, Malaysia

Faculty of Mechanical Engineering & Technology, Universiti Malaysia Perlis (UniMAP), Arau 02600, Perlis, Malaysia

Furutec Electrical Sdn. Bhd., MK13, Plot 89, Lorong Perindustrian Bukit Minyak 11, Kawasan Perindustrian Bukit Minyak, Simpang Ampat 14100, Penang, Malaysia

River Engineering and Urban Drainage Research Centre (REDAC), Universiti Sains Malaysia, Nibong Tebal 14300, Penang, Malaysia

Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Iasi, Blvd. D. Mangeron 71, 700050 Iasi, Romania

Technical Sciences Academy of Romania, Dacia Blvd 26, 030167 Bucharest, Romania

Romanian Inventors Forum, Str. Sf. P. Movila 3, 700089 Iasi, Romania

National Institute for Research and Development in Environmental Protection INCDPM, Splaiul Independentei 294, 060031 Bucharest, Romania

Funding

Ministry of Higher Education under Fundamental Research Grant Scheme, FRGS

References (46)

Show source-provided references
1. Experimental and analytical study on the bus duct system for the prediction of temperature variations due to the fluctuation of load10.5370/JEET.2014.9.6.2036 ↗
2. The optimal design of heat sinks: A review
3. Plate-fin heat sink forced convective heat transfer augmentation with a fractal insert10.1016/j.ijthermalsci.2019.04.035 ↗
4. Dake, T.J., and Majdalani, J. (2009, January 10–13). Improving flow circulation in heat sinks using quadrupole vortices. Proceedings of the ASME InterPack Conference, Beijing, China.10.1115/InterPACK2009-89211 ↗
5. Experimental study on the effects of fin pitches and tube diameters on the heat transfer and fluid flow characteristics of a fin punched with curved delta-winglet vortex generators10.1016/j.applthermaleng.2017.03.072 ↗
6. Effect of geometric size of curved delta winglet vortex generators and tube pitch on heat transfer characteristics of fin-tube heat exchanger10.1016/j.expthermflusci.2016.11.002 ↗
7. Heat transfer behavior of flat plate having spherical dimpled surfaces10.1016/j.csite.2016.09.004 ↗
8. A topology optimization based design of a liquid-cooled heat sink with cylindrical pin fins having varying pitch10.1016/j.ijheatmasstransfer.2021.121172 ↗
9. Optimization of plate fin heat sinks using entropy generation minimization10.1109/6144.926378 ↗
10. Natural convection heat transfer from horizontal and slightly inclined plate-fin heat sinks10.1016/j.applthermaleng.2013.09.003 ↗
11. Orientation effects on natural convection/radiation heat transfer from pin-fin arrays10.1016/0017-9310(86)90206-1 ↗
12. The orientation effect for cylindrical heat sinks with application to LED light bulbs10.1016/j.ijheatmasstransfer.2013.12.037 ↗
13. Orientation effects on natural convective performance of hybrid fin heat sinks10.1016/j.applthermaleng.2017.05.134 ↗
14. Influence of fin height on heat transfer and fluid flow characteristics of rectangular microchannel heat sink10.1016/j.ijheatmasstransfer.2019.04.012 ↗
15. Thermal performance of open microchannel heat sink with variable pin fin height10.1016/j.ijthermalsci.2020.106609 ↗
16. Aldoori, W.H. (2021). The effect of fin height on forced convection heat transfer from rectangular fin array. Mater. Today Proc., 1–8.
17. Numerical simulation of a solar air heater equipped with wavy and raccoon-shaped fins: The effect of fins’ height
18. Effects of pin fin height, spacing and orientation to natural convection heat transfer for inline pin fin and plate heat sinks by experimental investigation10.1016/j.ijheatmasstransfer.2021.121527 ↗
19. Thermal optimization of the pin-fin heat sink with variable fin density cooled by natural convection10.1016/j.applthermaleng.2021.116692 ↗
20. Performance analysis and design optimization of heat pipe sink with a variable height fin array under natural convection10.1016/j.applthermaleng.2019.113939 ↗
21. International Journal of Thermal Sciences Theoretical and numerical investigation on the fin effectiveness and the fin efficiency of printed circuit heat exchanger with straight channels10.1016/j.ijthermalsci.2018.06.029 ↗
22. Development of a theoretical model for predicting the thermal performance characteristics of a vertical pin-fin array heat sink under combined forced and natural convection with impinging flow10.1016/j.ijheatmasstransfer.2004.09.042 ↗
23. CFD analysis of heat transfer enhancement in plate-fin heat sinks with fillet profile: Investigation of new designs10.1016/j.tsep.2019.100458 ↗
24. Thermal performance and second law characteristics of two new microchannel heat sinks operated with hybrid nano fl uid containing graphene–silver nanoparticles10.1016/j.enconman.2018.05.020 ↗
25. Numerical investigation of heat transfer enhancement in plate-fin heat sinks: Effect of flow direction and fillet profile10.1016/j.csite.2018.100388 ↗
26. Pressure drop of impingement air cooled plate fin heat sinks10.1115/1.2721094 ↗
27. Impingement heat transfer of a plate fin heat sink with fillet profile10.1016/j.ijheatmasstransfer.2013.05.059 ↗
28. Thermal performance of plate-fin heat sinks under confined impinging jet conditions10.1016/j.ijheatmasstransfer.2006.09.024 ↗
29. CFD modeling of pin shape effects on capillary flow during wave soldering10.1016/j.ijheatmasstransfer.2014.01.037 ↗
30. Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach10.1016/j.icheatmasstransfer.2013.08.003 ↗
31. Finite volume-based simulation of the wave soldering process: Influence of the conveyor angle on pin-through-hole capillary flow10.1080/10407782.2015.1069675 ↗
32. Three-dimensional CFD simulation of the stencil printing performance of solder paste10.1007/s00170-020-05636-9 ↗
33. Effect of filing level and fillet profile on pin-through hole solder joint10.1007/s00170-018-03285-7 ↗
34. 3D thermal model and experimental validation of a low voltage three-phase busduct10.1016/j.applthermaleng.2016.09.002 ↗
35. Analysis of enhanced heat transfer on a passive heat sink with high-emissivity coating10.1016/j.ijthermalsci.2021.106971 ↗
36. Enhancement of heat dissipation of LED module with cupric-oxide composite coating on aluminum-alloy heat sink10.1016/j.enconman.2015.10.049 ↗
37. Microporous vertically aligned CNT nanocomposites with tunable properties for use in flexible heat sinks10.1016/j.jsamd.2022.100509 ↗
38. Heat transfer phenomena of copper-graphene nanocomposite coated aluminium heat spreaders: An interferometric study10.1016/j.applthermaleng.2022.118545 ↗
39. Improvement of heat sink performance using paraffin/graphite/hydrogel phase change composite coating10.1016/j.csite.2022.102470 ↗
40. A study on the effect of fin pitch variation on the thermal performance of a bus duct conductor10.1016/j.ijthermalsci.2022.107938 ↗
41. Numerical study on the effect of fin length variation on the thermal performance of a bus duct conductor10.1080/10407782.2022.2083892 ↗
42. (2022, October 10). Standard k-ε Model. Available online: https://www.afs.enea.it/project/neptunius/docs/fluent/html/th/node58.htm.
43. Evaluation of various turbulence models in predicting airflow and turbulence in enclosed environments by CFD: Part 2—Comparison with experimental data from literature10.1080/10789669.2007.10391460 ↗
44. Silver nanoparticle-based thermal interface materials with ultra-low thermal resistance for power electronics applications10.1016/j.scriptamat.2012.02.037 ↗
45. Coetzee, D., Venkataraman, M., Militky, J., and Petru, M. (2020). Influence of Nanoparticles on Thermal and Electrical Conductivity of Composites. Polymers, 12.10.3390/polym12040742 ↗
46. Welker, R.W. (2011). Size Analysis and Identification of Particles, William Andrew Publishing.10.1016/B978-1-4377-7883-0.00004-3 ↗