Research Progress of Cu-Ni-Si Series Alloys for Lead Frames
Source abstract
Abstract
This paper reviews the research progress of Cu-Ni-Si alloy as a lead frame material for ICs. Cu-Ni-Si alloy is considered a strong candidate for lead frame materials due to its excellent mechanical properties and adequate electrical conductivity. The types and properties of Cu-Ni-Si alloys are then discussed in detail, emphasizing strength and conductivity as two key indicators for evaluating the properties of Cu-Ni-Si alloys, as well as the challenges posed by their inverse correlation. The preparation methods of Cu-Ni-Si alloy, including conventional melting, vacuum melting, and jet forming, are also discussed, and the effects of different casting techniques on the alloy’s properties are analyzed. Furthermore, the conductivity and strengthening mechanisms of Cu-Ni-Si alloy, including solid solution strengthening, second phase strengthening, and deformation strengthening, are discussed. The effects of the Ni-Si atomic ratio, trace elements, and rare earth elements on the alloy’s properties are also discussed. Finally, the current research status of Cu-Ni-Si alloy is summarized, and future research directions are identified, including the development of new preparation technologies, establishment of systematic databases, and promotion of green manufacturing and sustainable alloy development.
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Research context
OpenAlex topics: Aluminum Alloy Microstructure Properties · Aluminum Alloys Composites Properties · Intermetallics and Advanced Alloy Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Materials, Shanghai Dianji University, Shanghai 201306, China
School of Mechanical Engineering, Shanghai Dianji University, Shanghai 201306, China
School of Aeronautics, Shanghai Dianji University, Shanghai 201306, China
School of Materials Science and Engineering, Henan Polytechnic University, Jiaozuo 454003, China
Funding
Natural Science Foundation of Shanghai · Three-year Action Plan of Shanghai Science and Technology Commission.
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