Surface Smoothing by Gas Cluster Ion Beam Using Decreasing Three-Step Energy Treatment
Source abstract
Abstract
A three-step treatment of Si wafers by gas cluster ion beam with decreasing energy was used to improve the performance of surface smoothing. First, a high energy treatment at 15 keV and an ion fluence of 2 × 1016 cm−2 was used to remove initial surface features (scratches). Next, treatments at 8 and 5 keV with the same fluences reduced the roughness that arose due to the formation of morphological features induced by the surface sputtering at the first high energy step. The surface morphology was characterized by the atomic force microscopy. The root mean square roughness Rq and 2D isotropic power spectral density functions were analyzed. For comparison, the smoothing performances of single-step treatments at 15, 8, and 5 keV were also studied. The lowest roughness values achieved for the single and three-step treatments were 1.06 and 0.65 nm, respectively.
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Research context
OpenAlex topics: Ion-surface interactions and analysis · Integrated Circuits and Semiconductor Failure Analysis · Diamond and Carbon-based Materials Research
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Institute of Technological Sciences, Wuhan University, Wuhan 430072, China
School of Power & Mechanical Engineering, Wuhan University, Wuhan 430072, China
Wuhan University Shenzhen Research Institute, Nanshan Hitech Zone, Shenzhen 518057, China
International Joint Research Center for Surface and Interface Materials Science and Engineering, Wuhan University, Wuhan 430072, China
Utkin Ryazan State Radio Engineering University, Ryazan 390005, Russia
Centre for Physics and Technological Research (CeFITec), Universidade Nova de Lisboa, 2829-516 Caparica, Portugal
Funding
Hubei Provincial and Municipal Double First-class Talent Construction Start-up Fund in 2022 · Key R&D program of Hubei Province · Science and Technology Planning Project of Shenzhen Municipalit · National Key Research and Development Program of China
References (33)
Show source-provided references
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