journal article·2026Open access

Integrating FDC and Machine Learning for Enhanced Anomaly Detection in WB Bonding Joint Quality

Chin Ta Wu, Shing Han Li, Ching Shih Tsou

Computers, Materials & Continua· Volume 0· Issue 0

Abstract

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Source: Not provided · Quality: missing

Research context

OpenAlex topics: 3D IC and TSV technologies · Physical Unclonable Functions (PUFs) and Hardware Security · VLSI and Analog Circuit Testing

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References

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