Properties of epoxy nanocomposite thin films prepared by spin coating technique
Source abstract
Abstract
Tensile and dynamic mechanical properties of thin film epoxy composites containing different types of fillers such as synthetic diamond (SD), silicon nitride, and boron nitride (BN) were investigated. The filler contents were varied between 0 and 2 vol.%. Spin coating technique was employed to produce thin film with thickness of 40–60 µm. Tensile test results show that addition of SD obviously improves the strength and Young's modulus, and increases the storage modulus ( E′) of the epoxy thin film composite. The addition of 2 vol.% SD increases the Young's modulus and tensile strength by almost two times the properties of neat epoxy. Scanning electron microscopy showed void formation and poor interfacial analysis which explains the reduced tensile strength of BN filler epoxy composites.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Advanced Fiber Optic Sensors · Diamond and Carbon-based Materials Research · Polymer Nanocomposites and Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Material and Mineral Resources Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia.
Intel Technology (M) Sdn. Bhd, Penang, Malaysia.
References (31)
Show source-provided references
1. Siegel RW, Hu EH and Roco MC. Panel report on R&D status and trends in nanoparticles, nanostructured materials, and nanodevices. In: WTEC workshop 1998 http://www.wtec.org/loyola/nano/us_r_n_d/toc.htm (Accessed 16 March 2011).
2. Kumar A · 1999
3. Richter F · 1998 · 153
4. 10.1002/cvde.20050644210.1002/cvde.200506442 ↗
5. 10.1021/jp013570+10.1021/jp013570+ ↗
6. 10.1023/A:102442781066810.1023/A:1024427810668 ↗
7. 10.1016/j.colsurfa.2005.02.00810.1016/j.colsurfa.2005.02.008 ↗
8. 10.1016/j.colsurfa.2006.10.02710.1016/j.colsurfa.2006.10.027 ↗
9. 10.1063/1.172330010.1063/1.1723300 ↗
10. 10.1002/pen.1037310.1002/pen.10373 ↗
11. Scriven LE. Physics and applications of dip coating and spin coating. In: Materials Research Society Symposium Proceedings, Strasbourg , France, 8–10 November 1988.10.1557/PROC-121-717 ↗
12. Larson RG, Rehg TJ. Liquid film coating: Scientific principles and their technological implications London: Chapman & Hall, 1997673–708.
13. 10.1177/875608791038724110.1177/8756087910387241 ↗
14. 10.1039/b922027e10.1039/b922027e ↗
15. 10.1016/j.actamat.2007.01.00710.1016/j.actamat.2007.01.007 ↗
16. 10.1177/073168440935116610.1177/0731684409351166 ↗
17. 10.1177/87560879940100040410.1177/875608799401000404 ↗
18. 10.1016/j.compositesb.2010.09.00310.1016/j.compositesb.2010.09.003 ↗
19. Kiyotaka W · 2004
20. Shenderov OA · 2006
21. Bharat B. Springer handbook of nanotechnology, 2nd ed. New York, NY: Springer, 20061699–1699.
22. Wong CP and Bollampally RS. Mixed filler combinations for enhanced thermal conductivity of liquid encapsulant for electronic packaging. In: International symposium on advanced packaging materials conference , Braselton, GA, USA, 14–17 March 1999.
23. 10.1016/j.jeurceramsoc.2004.10.01610.1016/j.jeurceramsoc.2004.10.016 ↗
24. 10.1002/app.1043610.1002/app.10436 ↗
25. 10.1016/S0266-3538(02)00079-910.1016/S0266-3538(02)00079-9 ↗
26. 10.1177/87560879850010021010.1177/875608798500100210 ↗
27. 10.1016/j.polymer.2008.03.02110.1016/j.polymer.2008.03.021 ↗
28. 10.1002/app.1354210.1002/app.13542 ↗
29. 10.1002/polb.2080010.1002/polb.20800 ↗
30. 10.1016/j.msec.2003.09.13110.1016/j.msec.2003.09.131 ↗
31. 10.1007/s10853-005-5472-010.1007/s10853-005-5472-0 ↗