New Products
Source abstract
Abstract
A new development in palladium‐nickel processes is available from Engelhard. ‘Pallnic’ II is an improvement on the established market leader ‘Pallnic’ which was designed to function as a substitute for acid hard gold deposits used in connectors, printed circuits and other electronic components. ‘Pallnic’ II uses a novel palladium complex to improve the deposit and electrolyte properties even further, which makes it a very realistic and cost‐effective alternative to gold plating. Two processes are available.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Metallurgy and Material Science
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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