New Products
Source abstract
Abstract
Du Pont has introduced a new range of low residue solder pastes, specially developed for the attachment of fine pitch and other surface mount components to printed circuit boards and ceramic substrates without the need for post‐assembly cleaning.
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Flexible and Reconfigurable Manufacturing Systems
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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