International Institute News
Source abstract
Abstract
The Electronic Industries Association (EIA) has announced the release of EIA‐364–71, Solder Wicking Test Procedure for Electrical Connectors/ Sockets (Wave Solder Technique), formerly Standards Proposal No. 2185‐A. The object of this test is to determine whether a connector can be wave soldered to a printed wiring board without sustaining damage caused by solder wicking onto the contact surfaces or other areas that might alter its operating characteristics.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Electrical Contact Performance and Analysis · Adhesion, Friction, and Surface Interactions
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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