New Products
Source abstract
Abstract
A through‐plating facility designed by Heraeus eliminates the need for electroless copper. The new compact facility, which can handle printed circuit boards measuring up to 250 x 450 mm, is easy to operate and causes no damage to the environment. In spite of dispensing with electroless copper, complexing agents and formaldehyde, a high degree of quality in the through‐plating of drilled holes is achieved.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Diverse Musicological Studies · Metallurgy and Material Science
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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