The production of large format backplanes—part 2Presented at the ICT 27th Annual Symposium, 2 May 2001
Source abstract
Abstract
The first part of this article was published in Circuit World (Volume 28, Issue 2) and in this second part the final stages of large format backplane manufacture from the desmear and metallisation process onwards are described.
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Metallurgy and Material Forming · Metal Forming Simulation Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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