BS 9000 and Printed Circuits

The BS 9760 series of specifications, covering rigid and flexible printed circuits, is described. The objectives and structure of the BS 9000 specification system are also described, with particular emphasis on the Capability Approval procedure invoked by BS 9760 (1977). BS 9760 requires the use of standard test patterns wherever possible, thus ensuring a consistent assessment of each approved manufacturer. Recently agreed additions to the current documents include a revised thermal shock test for plated through‐holes, a test pattern and tests for solder‐resist and marking inks, and a procedure for assessing re‐work. Draft harmonised CECC specifications have a very strong relationship with BS 9760.