Packlayer—Alternative to Conventional Printed Circuit Boards
Source abstract
Abstract
The printed circuit board version, ‘packlayer’, represents an alternative to printed circuit boards with conventional solder mask systems which is not yet widely known. This alternative type does, however, offer some considerable advantages in comparison with printed circuit boards with solder resist, with the result that the higher cost involved is thoroughly acceptable. Through the development of a new system called ‘Low‐Cost‐Packlayer’, bearing the special name MeSoMask, a variant has emerged within the packlayer sector. This special version combines the advantages of the packlayer with the costs of a conventional solder resist system and therefore presents a genuine alternative to the normal printed circuit board.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Recycling and Waste Management Techniques · Electronic Packaging and Soldering Technologies · Additive Manufacturing and 3D Printing Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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