The new immersion tin generation in practical operation – a surface finish process including the world's first organic metal
Source abstract
Abstract
This paper describes the properties of a new generation of immersion tin as a solderable surface finish for printed circuit boards. The new process combines the unique technology of Organic Metals with the well introduced technology of immersion tin. A comparison with other solderable surface finishes will show the advantages and superior performance for PCB manufacturer, assemblers and OEMs.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies
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