Treatment of Copper Surfaces in Printed Circuit Manufacture
Source abstract
Abstract
Copper surfaces of laminates can be damaged by abrasively brushing prior to chemical processing. This is especially important where gold plated edge connectors are made to the latest Post Office specification of 2·5 µm. Chemical rather than abrasive treatment results in a pore‐free surface which is vital when the gold is thin.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability · Adhesion, Friction, and Surface Interactions
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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