The Fourth Electronic Revolution
Source abstract
Abstract
The electronics industry is now entering a phase in its development where significant increases in the use of its products (in volume terms) will take place. This growth, triggered by performance and cost advances in ICs, will in turn have a considerable impact on the packaging and interconnection of these electronic products. This paper looks at the problems and opportunities associated with the necessary innovations in electronic packaging and interconnection and what progress is being made around the world.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: 3D IC and TSV technologies · Semiconductor Lasers and Optical Devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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