The Future of Electronics in Europe
Source abstract
Abstract
The paper reviews major changes in technology, integrated circuit packaging, materials and surface mounting techniques, and assesses their impact on the printed circuit board industry. It identifies major forces and examines interconnection technologies such as thick film and new techniques for providing interconnections of ICs as related to the technology in Europe.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: 3D IC and TSV technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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