The Impact of Metal Cored Multilayer Boards for Surface Mounted Devices
Source abstract
Abstract
The new generation of SMDs (LCCs) can now be mounted on multilayer printed circuits which offer a thermal expansion similar to that of ceramic. In addition, a thermal management solution is available as a means of removing heat generated by the devices. This paper discusses the new development in multilayer board design construction and component assembly associated with metal core boards. New methods of selective plating component footprints are also discussed.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Manufacturing Process and Optimization
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