Multichip Modules for Advanced Applications
Source abstract
Abstract
This paper discusses the increasing activity being directed towards microminiature multichip module packaging. It shows new substrate materials that are being investigated, including multilayer thin‐film ceramics and silicon wafers. Wire bonding, tape‐automated bonding (TAB), and flip device termination techniques are covered. Particular attention is given to the use of multichip modules for advanced data processing applications.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: 3D IC and TSV technologies · VLSI and FPGA Design Techniques · Electronic Packaging and Soldering Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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