Troubleshooting in the Electroless Copper Process
Source abstract
Abstract
In this paper, reproduced by permission of the Institute of Printed Circuits (USA), the author discusses the factors which can affect the quality and adhesion of electroless copper plating on printed circuit boards and recommends procedures to ensure optimum results.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electrodeposition and Electroless Coatings
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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