Hydrogen Peroxide/Sulphuric Acid Etching Systems
Source abstract
Abstract
The paper deals with the use of a Hydrogen Peroxide/Sulphuric Acid etchant in the Through‐Hole Plating system. The relative merits of this solution compared to currently used etchants such as Ammonium Persulphate are discussed on the basis of cost, convenience of operation and ecological effect.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Copper Interconnects and Reliability · Additive Manufacturing and 3D Printing Technologies
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References
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