Broader Functions and Improved Reliability of Printed Circuit Boards Using Dry Film Solder Mask Systems
Source abstract
Abstract
This paper deals with the design of PCBs, using the dielectric properties of solder mask as an insulation layer to protect boards and components; the elimination of selective solder filling of component holes; the protection of via holes during soldering, and the preparation of artwork, with particular attention to design tolerances using dry film solder mask. Future prospects in PCB design, employing dry film solder mask, are also discussed.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Recycling and Waste Management Techniques · Electronic Packaging and Soldering Technologies · Additive Manufacturing and 3D Printing Technologies
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References
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