Automated Edge Connector Plating Equipment for Printed Circuit Boards
Source abstract
Abstract
This paper describes the development of a new generation automated edge connector plating system specifically concerned with the even distribution of precious metal on the connector surfaces. Other aspects include the minimisation of process chemical contamination through the development of special interstage sealing methodology, and the introduction of high speed process chemical technology.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Flexible and Reconfigurable Manufacturing Systems · 3D IC and TSV technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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