Multilayer Rigid‐flex Printed Wiring Design Considerations
Source abstract
Abstract
Rigid‐flex printed wiring constructed in different multilayer configurations and with varying features is discussed. Materials used in rigid‐flex construction have widely varying properties which cause processing difficulties and thermal stress related problems which can be minimised by proper construction features. Examples of failure mechanisms due to improper construction or material usage are given. Design considerations which will avoid construction related defects are summarised.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Mechanical stress and fatigue analysis · Advanced Surface Polishing Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
Reference metadata was not supplied for this record.