Equipment Selection for Tape Automated Bonding (TAB)
Source abstract
Abstract
The manufacturing process involving the bonding of ultra‐fine pitch TAB solder joints into printed circuit substrates requires precision equipment. This paper describes the basic components of any type of outer lead bonding (OLB) TAB equipment. It goes on to explain a selection methodology to be used when selecting equipment for customer applications. Specific examples are used to aid the equipment consumer in selecting the optimum equipment set and verifying the machine's accuracy and reliability.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Manufacturing Process and Optimization · Electronic Packaging and Soldering Technologies · Flexible and Reconfigurable Manufacturing Systems
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
Reference metadata was not supplied for this record.