Three‐dimensional Circuitisation of Plastic Mouldings
Source abstract
Abstract
This paper briefly discusses various solutions to 3‐D PCBs by giving an overview of available technologies. Specific attention is then directed to the author's company's technique. Coverage of aspects such as: Potential Market Size and Relationship to Existing Technologies, Functional Specification, Test Results, and Low Tool Costs is given.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Additive Manufacturing and 3D Printing Technologies · 3D IC and TSV technologies · Material Properties and Processing
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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