Fine Line Conductor Formation
Source abstract
Abstract
Driven by the demand for higher density in electronic packaging, each signal plane of printed wiring board must accommodate more conductors. As a result, conductor width is becoming narrower each year. This chapter reviews some of the important steps of forming finer line conductors in printed wiring boards, such as surface preparation, plating/etching, photo‐exposure, automatic optical inspection, etc.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Material Properties and Processing · Recycling and Waste Management Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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