Acid Copper Plating High Aspect Ratio Multilayer Circuit Boards
Source abstract
Abstract
The throwing power of the acid copper plating process is affected by solution composition, organic additives, plating conditions and bath geometry. Recommendations for optimising these areas are given and production experiences reported.
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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