A Unique Way of Placing Via Hole Connections in the SMD Pads Gives Increased Routing Space on Printed Circuit Boards
Source abstract
Abstract
Via holes in SMD solder pads normally disturb the flow of the solder during soldering. To avoid this, expensive processes whereby the holes are filled with solder cream are used by the assembler. The paper describes a technique which allows the designer to design ‘Vias in SMD Solder Pads’ and so gain additional routing space on the printed boards, yet maintaining good solderability, using standard soldering processes.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Manufacturing Process and Optimization
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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