Thermal Implications of Using Chip Carriers with Current Laminates
Source abstract
Abstract
The evolution of epoxy glass fibre PCBs generally accepted by the industry has not produced major developments in laminate technology. Microminiaturisation of components, improved packaging of ICs by chip carriers has made apparent that current laminates will be unable to meet interconnection needs and thermal dissipations. This paper discusses the thermal characteristics of alternative systems using metal cored boards and ceramic substrates.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Additive Manufacturing and 3D Printing Technologies
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References
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