article·1975-01-01

Photosensitive Resist Printing

H.R. Shemilt

Publisher page

Abstract

In this series of articles on printed circuit troubleshooting, the author in this issue of the journal focuses his attention on photoresists. The problems that most commonly occur during lamination, film development, subsequent plating processes, coating consistency, resist exposure and development are detailed.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Advancements in Photolithography Techniques · Electronic Packaging and Soldering Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References

Reference metadata was not supplied for this record.