Gold Plating of Printed Circuit Boards and Wire
Source abstract
Abstract
In this paper, reproduced by permission of “Metal Finishing” (New Jersey), the author enumerates the required properties of electroplated gold coatings on printed circuit boards and wire to ensure satisfactory bonding by ultrasonic means. The gold plating procedures and process control methods which are necessary to produce coatings yielding consistently high bond strengths are described.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Recycling and Waste Management Techniques · Material Properties and Processing
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References
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