Products ♦ Processes ♦ Materials ♦ Equipment
Source abstract
Abstract
A new gold electroplating process introduced by Imasa/Silvercrown has been developed specifically for the bonding of silicon chips to leadframes in the manufacture of integrated circuits.
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Manufacturing Process and Optimization
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
Reference metadata was not supplied for this record.