Numerical simulation of embedded passive components in multi‐layer PCB structures

Numerical modelling is used to predict the thermal behaviour of embedded passive components in multi‐layer PCBs. A three‐signal layer PCB, containing embedded resistors of dimensions 0.3 6 0.3mm and thickness 0.1μm, is used to generate thermal design rules that can be applied to a wide range of PCB structures containing embedded passive components. A software package using the design rules can then make fast predictions on the thermal behaviour of heat‐generating components inside such structures.