Designing for Zero‐defect Soldering
Source abstract
Abstract
This paper describes how PCB designers must adjust their approach to take into account the new requirements for the production of high technology printed circuit boards using the latest plated‐through hole and surface mounting techniques. It also describes how the correct use of dry film solder masks is contributing towards the achievement of zero‐defect soldering.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Flexible and Reconfigurable Manufacturing Systems
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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