article·1989-01-01

Inner Layer or Post Cracking on Multilayer Printed Circuit Boards

Morven Gray

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Abstract

The possible causes of inner layer junction cracks on multilayer PCBs are discussed and the problems that cracks can cause under rework conditions. The procedure to identify the cracks and their exact location within and around the electroless copper junction is shown, along with guidelines on the possible ways to eliminate the cracking problem and on testing procedures to ensure a reliable product.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · Material Properties and Processing · Electromagnetic Compatibility and Noise Suppression

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