Inner Layer or Post Cracking on Multilayer Printed Circuit Boards
Source abstract
Abstract
The possible causes of inner layer junction cracks on multilayer PCBs are discussed and the problems that cracks can cause under rework conditions. The procedure to identify the cracks and their exact location within and around the electroless copper junction is shown, along with guidelines on the possible ways to eliminate the cracking problem and on testing procedures to ensure a reliable product.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Material Properties and Processing · Electromagnetic Compatibility and Noise Suppression
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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