PCB Vacuum Bonding Autoclave—Vacuum Bagging Techniques
Source abstract
Abstract
This paper describes the new technique used by International Computers Limited for vacuum bagging multilayer PCB bonding stacks. It is used as a cost‐effective alternative to previous consumable bagging systems used in autoclave vacuum bonding.
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Structural Analysis of Composite Materials · Material Properties and Processing
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References
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