A New Adhesive System for Heat Sink Bonding
Source abstract
Abstract
Current techniques for bonding thermal planes or heat sinks utilise materials and methods initially designed for other applications and so have several disadvantages. The new system described in this paper has been developed to give the optimum combination of bonding properties for this specific application.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Manufacturing Process and Optimization · Product Development and Customization
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
Reference metadata was not supplied for this record.