Chemical Copper Plating in the Additive Process
Source abstract
Abstract
The copper plating of through holes and PCB surfaces in the additive process places high demands on the chemical copper bath and the resultant deposit. This paper illustrates the extent to which specific characteristics of the deposition and inhibition mechanism can be used to advantage.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Additive Manufacturing and 3D Printing Technologies · Additive Manufacturing Materials and Processes
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References
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