Non‐conventional Substrates
Source abstract
Abstract
This paper describes recent printed board applications in circuit manufacturing on novel non‐laminate substrates. It specifically discusses properties pertinent to metal core, thermal plastics, and new processing conditions for circuitising the new substrates. Techniques explored are intended to provide rigidity, flatness, dimensional stability and improved thermal management.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Additive Manufacturing and 3D Printing Technologies · 3D IC and TSV technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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