Sequential Experimental Study and Optimisation of an Acid Copper Pattern Plating Process
Source abstract
Abstract
Sequential application of fractional factorial and response surface designs in the regression modelling and optimisation of a multi-parameter type manufacturing process is presented. In particular, the coating thickness variation of an acid copper plating process was minimised with high bath acidity, high cathodic current density and large anode-cathode separation. Statistically designed experiments are shown to be highly effective in studying the effects and interactions of the various process factors.
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Research context
OpenAlex topics: Optimal Experimental Design Methods · Aluminum Alloy Microstructure Properties · Injection Molding Process and Properties
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Affiliations
Department of Manufacturing Engineering, City University of Hong Kong, Hong Kong
References (7)
Show source-provided references
1. 1 Barringer, T. and Carano, M., ‘Optimization of an Acid Copper Plating Bath for Through-hole Plating’, Proceedings 12th AES Plating in the Electronic Industry Symposium (1985).
2. ‘Current Density Effect’
3. ‘Investigation of Copper Deposition on Printed Circuit Boards Using Taguchi Methods’10.1108/eb046144 ↗
4. ‘PCB Plated Through Hole Optimization: A Case Study in SPC’10.1108/eb046068 ↗
5. ‘Optimization of a Copper Pattern Plating Process with Planned Experimentation and Response Surface’
6. 6 Montgomery, D. C., ‘Statistical Process Control in Manufacturing’, Marcel Dekker, pp. 157-183 (1991).
7. 7 Khuri, A. I. and Cornell, J. A., ‘Response Surfaces Designs and Analyses’, Marcel Dekker, pp. 105-205 (1987).