Interlayer Alignment in Multilayer PCBs
Source abstract
Abstract
A measurement tool, capable of monitoring misalignment of layers in multilayer printed circuit boards, is described. Its uses, limitations and its advantages for use in SPC and reliability predictions are highlighted.
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Electromagnetic Compatibility and Noise Suppression · Integrated Circuits and Semiconductor Failure Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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