Polyethersulphone—A Thermoplastic PCB Substrate
Source abstract
Abstract
‘Victrex’ polyethersulphone (PES) is introduced as a high temperature thermoplastic with properties attractive to the electronics industry. The polymer can be fabricated by conventional thermoplastic techniques, such as extrusion and moulding, and the parts metallised in several ways. Applications utilising these aspects are shown. Parts can be reflow or wave soldered and flux residues washed off without damaging the substrate. Some current PCB developments are discussed and a look into the future is offered as designers begin to take advantage of the thermoplastic nature of polyethersulphone.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Recycling and Waste Management Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
Reference metadata was not supplied for this record.