Rework of Multi‐chip Modules: Device Removal

This paper will review rework of multi‐chip modules (MCMs). The issues of die removal from substrates (i.e., PCBs) with different chip‐to‐substrate interconnect technologies will be explored in detail. These different interconnect technologies (e.g., wire bonding, tape automated bonding and flip chip bonding) and die‐attachment methods (e.g., eutectic and adhesive) have a strong influence on the MCM rework process and equipment selection. Traditional surface mount (SM) and current MCM rework technologies are also compared. It will be shown that traditional SMT rework processes and equipment are unable to solve the level of difficulty involved in fine‐pitch MCM device removal—especially for systems which require heat removal through the substrate.