Overcoming Thermal Problems in Multilayer Printed Circuit Boards
Source abstract
Abstract
This paper will attempt to highlight significant problems of a thermal nature, encountered during 17 years' extensive use of multilayer printed circuit boards in high technology Avionics Systems, together with recommended corrective actions.
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Silicon Carbide Semiconductor Technologies · Manufacturing Process and Optimization · Electronic Packaging and Soldering Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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