I/C Packaging and Interconnection Developments

This paper describes the major new I/C packaging technologies now coming into use, i.e., chip carriers and tape automated bonding. It deals with the reasons for their development, where they are most likely to be used and their impact on current interconnection technologies, i.e., PCBs and thick film hybrids. The paper also looks briefly at some new developments in ‘off‐the‐chip’ interconnection, e.g., laminates and materials.